System-in-Package and Module Assembly
Several die plus passives are assembled into a single package or module, the format Kaynes Semicon used for India’s first commercially packaged multi-chip parts.
A Rs 5-15 Cr line puts this above a founder-scale entry, but TSAT is already shipping SiP and an Indian JV or a distributor plus assembly service is the realistic path.
Bundles several chips and parts into one finished module
- Combines multiple chips and components into a single package.
- One weak component out of many can drag the whole module down.
- The format an Indian plant, Kaynes Semicon, is already shipping.
India Position
- Import dependency
- Not established
- Made in India today
- Pilot scale
- MSME entry capital
- Rs 5–15 Cr
- Time to qualify
- 12–18 months
Not established means we hold no sourced import figure for this input yet, not that India imports none of it. Read Made in India today for the domestic picture.
Kaynes Semicon is producing multi-chip modules at Sanand. It is a pilot in scale terms, not in capability terms.
What Breaks, and Who Could Fix It
The difficulty moves from any single process into the combination: mixed component heights, mixed thermal profiles, and a bill of materials with dozens of line items instead of two.
This is the most realistic near-term point of contact between India’s EMS base and its new packaging plants, because the component vocabulary overlaps.
Best and worst case
SiP reuses wire bond, flip chip and surface-mount equipment a plant already owns, so the incremental capital is modest.
Yield is multiplicative. A module with fifteen components at 99.5% each does not reach 99.5%, and known-good-die discipline becomes the whole game.
The passive components, shielding cans and module substrates are all genuinely reachable by Indian manufacturers, several of whom already serve EMS.
Semiconductor-grade qualification is still a step above EMS-grade, and firms routinely underestimate that gap.
Representative Suppliers
Listing a firm documents the market as we understand it. It is not an endorsement, a recommendation, or evidence of any commercial relationship.
| Supplier | Origin | Scale | Confidence |
|---|---|---|---|
| Kaynes Semicon Delivered India’s first commercially packaged multi-chip modules. | India | Mid | Verified |
| ASE Group | Taiwan | Mega | Verified |
| Amkor Technology | United States | Large | Reported |
| USI (Universal Scientific Industrial) | China | Large | Reported |
| Syrma SGS Technology Module-level assembly from the EMS side rather than the OSAT side. | India | Mid | Likely |
Where It Is Consumed
The die is bonded to a leadframe or substrate using epoxy paste, adhesive film, or solder.
The platform fork. Fine gold or copper wire is ball- or wedge-bonded, or solder bumps are reflowed and underfilled. ISP combines both.
Epoxy moulding compound is transfer-moulded around the die under heat and pressure in a multi-cavity tool.
Read Next
- Wire Bonding directory entry
- Flip-Chip Attach and Reflow directory entry
- Tape-and-Reel and Finished-Goods Packing directory entry
- Package and PCB Co-Design Tools directory entry
- Package Design and Signal Integrity directory entry
- Assam Is Building a ₹27,000 Crore Chip Plant. This Is The Ecosystem It Needs To Run report
- Semiconductor Packaging Clusters in Asia report
Sources
- TSAT packaging process and MSME component map as of 2026-08
- Semiconductor OSAT clusters: Penang, Sanand, Morigaon as of 2026-04
Last reviewed 2026-08-28.
How to read this page
Reading Key
Every entry carries the same five figures, so two inputs anywhere in the chain can be compared directly. What each one is, and what it is not:
- Import dependency
- The share of Indian demand for this input that is met by imports today. A percentage is published only where we can state the basis for it, and the build rejects a figure that has none. “Not established” means no sourced figure exists yet, not that the figure is zero; for the domestic picture, read “Made in India today” instead.
- Made in India today
- How much of this input is actually produced in India: none, pilot scale, partial, or established. This is the field to read when import dependency is not established.
- MSME entry capital
- What it would plausibly cost an Indian MSME to enter this input at the smallest viable scale, in crore rupees. Plant and equipment only; it excludes working capital and the qualification cycle.
- Time to qualify
- How long from a working sample to a qualified first shipment, once the line exists. Qualification, not construction, is what usually decides whether an entry succeeds.
- India readiness tier
- Our verdict on whether an Indian founder can realistically enter this input, derived from the four figures above and stated as one of three tiers.
The three tiers
- Tier A: Buildable Now
- Under roughly Rs 5 crore of entry capital and 12 to 24 months to a qualified first shipment. A founder can start here.
- Tier B: Partnership or Distribution
- There is real money here, but not in manufacturing the thing. The opening is in stocking, distribution, purity uplift or a licensed partnership.
- Tier C: Not Yet
- Requires a joint venture, a technology licence, or a multinational’s balance sheet. Worth understanding, not worth starting.
Made in India today
- None
- No Indian production we can identify. Demand is met entirely from abroad.
- Pilot scale
- Made in India at laboratory, pilot-line or single-customer scale only.
- Partial
- Real Indian production exists, but it covers part of the range or part of the demand.
- Established
- Indian production is routine and qualified, at commercial volume.
Confidence
Confidence describes how well evidenced our listing is. It is not a rating of the supplier or of its products.
- Verified
- Checked against a primary source: the firm’s own filing, product documentation or announcement.
- Reported
- Consistently reported by trade press or industry analysts, but we have not seen the primary document ourselves.
- Likely
- A credible supplier for this input given their product range, though we have not confirmed that they actually supply it.
- Directional
- Included to show the shape of the market. Read it as an observation, not as a claim about this firm.
Scale
Scale is a bucket, not a revenue figure. We publish a band we can hold for years rather than a number that is stale in a quarter.
- Mega
- A global top-tier firm that effectively sets the price and the standard for this input.
- Large
- A major international supplier, usually with plants or sales in several regions.
- Mid
- An established specialist, often strong in one region or one product family.
- Small
- A niche or regional supplier. Frequently the realistic first partner for a new Indian entrant.