Back-End and OSAT Assembly

Die Attach and Pick-and-Place

The operation that lifts each die off the tape and bonds it to a leadframe or substrate at rates approaching 30,000 units an hour.

Tier B: Right Opportunity, Wrong Mental Model High criticality

The tool is out of reach; the consumable tooling around it is reachable through an OEM spares relationship rather than a direct sale.

What It Does

Picks up each chip and bonds it down, tens of thousands per hour

India Position

Import dependency
Not established
Made in India today
None
MSME entry capital
Rs 1.5–3 Cr
Time to qualify
12–18 months

Not established means we hold no sourced import figure for this input yet, not that India imports none of it. Read Made in India today for the domestic picture.

Every die bonder in every Indian ATMP plant is imported. The wear parts are too, which is the openable part.

What Breaks, and Who Could Fix It

What breaks

Placement accuracy and bondline thickness control set the ceiling on everything downstream: wire bond reliability, thermal path, and warpage all trace back to how the die was seated.

Who could fix it

Pick-up collets, ejector needles and bond tools are wear parts consumed continuously, made to micron tolerances, and exactly the kind of work a qualified Indian tool room could take.

Best and worst case
Best case if this breaks

Die bonders are available from at least four credible vendors, so this is one of the few back-end tools with real supplier competition.

Worst case if this breaks

Bonder throughput is usually the line’s bottleneck. Under-specify it during ramp and the whole plant runs at the speed of this station.

Best case to fix it

The adhesive and the film are the MSME positions; both have their own entries. Bond-head tooling and collets are a precision machining adjacency.

Worst case to fix it

These are tiny, high-value, high-liability parts. One bad collet scratches thousands of die before anyone notices.

Representative Suppliers

Listing a firm documents the market as we understand it. It is not an endorsement, a recommendation, or evidence of any commercial relationship.

SupplierOriginScaleConfidence
ASMPT The largest die bonder supplier by installed base. Singapore Large Verified
BE Semiconductor Industries (Besi) Netherlands Mid Verified
Kulicke & Soffa Singapore Mid Verified
Palomar Technologies Precision and photonics die attach rather than high volume. United States Small Reported
Shinkawa Japan Small Reported

Where It Is Consumed

Step 2: Die Attach

The die is bonded to a leadframe or substrate using epoxy paste, adhesive film, or solder.

Read Next

Sources

Last reviewed 2026-08-28.

How to read this page

Reading Key

Every entry carries the same five figures, so two inputs anywhere in the chain can be compared directly. What each one is, and what it is not:

Import dependency
The share of Indian demand for this input that is met by imports today. A percentage is published only where we can state the basis for it, and the build rejects a figure that has none. “Not established” means no sourced figure exists yet, not that the figure is zero; for the domestic picture, read “Made in India today” instead.
Made in India today
How much of this input is actually produced in India: none, pilot scale, partial, or established. This is the field to read when import dependency is not established.
MSME entry capital
What it would plausibly cost an Indian MSME to enter this input at the smallest viable scale, in crore rupees. Plant and equipment only; it excludes working capital and the qualification cycle.
Time to qualify
How long from a working sample to a qualified first shipment, once the line exists. Qualification, not construction, is what usually decides whether an entry succeeds.
India readiness tier
Our verdict on whether an Indian founder can realistically enter this input, derived from the four figures above and stated as one of three tiers.

The three tiers

Tier A: Buildable Now
Under roughly Rs 5 crore of entry capital and 12 to 24 months to a qualified first shipment. A founder can start here.
Tier B: Partnership or Distribution
There is real money here, but not in manufacturing the thing. The opening is in stocking, distribution, purity uplift or a licensed partnership.
Tier C: Not Yet
Requires a joint venture, a technology licence, or a multinational’s balance sheet. Worth understanding, not worth starting.

Made in India today

None
No Indian production we can identify. Demand is met entirely from abroad.
Pilot scale
Made in India at laboratory, pilot-line or single-customer scale only.
Partial
Real Indian production exists, but it covers part of the range or part of the demand.
Established
Indian production is routine and qualified, at commercial volume.

Confidence

Confidence describes how well evidenced our listing is. It is not a rating of the supplier or of its products.

Verified
Checked against a primary source: the firm’s own filing, product documentation or announcement.
Reported
Consistently reported by trade press or industry analysts, but we have not seen the primary document ourselves.
Likely
A credible supplier for this input given their product range, though we have not confirmed that they actually supply it.
Directional
Included to show the shape of the market. Read it as an observation, not as a claim about this firm.

Scale

Scale is a bucket, not a revenue figure. We publish a band we can hold for years rather than a number that is stale in a quarter.

Mega
A global top-tier firm that effectively sets the price and the standard for this input.
Large
A major international supplier, usually with plants or sales in several regions.
Mid
An established specialist, often strong in one region or one product family.
Small
A niche or regional supplier. Frequently the realistic first partner for a new Indian entrant.